บุคลากร

คณาจารย์

ผศ.ดร. ประพจน์ ขุนทอง

หัวหน้าภาควิชา

Contact Information

ห้องทำงาน: 5402/13
เบอร์ติดต่อ: 02-942-8555 ต่อ 1830
อีเมล์: fengppk@ku.ac.th

Administrative Work

  • Deputy Head, Department of Mechanical Engineering

Education

  • B.eng. (Mechanical Engineering), Kasetsart University, Thailand
  • M.s. (Engineering Mechanics, Specialization In Experimental Stress Analysis), Clemson University, Usa
  • Ph.d. (Civil Engineering, Specialization In Computational Mechanics), Clemson University, USA

Awards & Honors

  • One Of Six Finalists For The 16th Annual Robert J. Melosh Medal Competition For The Best Student Paper On Finite Element Analysis, 2004
  • Best Paper Of Session, The 32nd International Symposium On Microelectronics, Imaps, 1999

Courses

  • 01208111: Engineering Drawing
  • 01208221: Engineering Mechanics I (Statics)
  • 01208261: Mechanics Of Solids
  • 01208271: Computer Methods For Mechanical Engineering
  • 01208496: Selected Topics In Me: Introduction To Finite Element Methods
  • 01208511: Engineering Analysis For Mechanical Engineers
  • 01208533: Experimental Stress Analysis

Fields of Interest

  • Experimental Stress Analysis: Photoelasticity, Moire Interferometry
  • Computational Mechanics: Space-time Discontinuous Galerkin Finite Element Methods, Residual Based Finite Element Methods, Numerical Methods For Problems In Infinite Domains, Fatigue Analysis Using Numerical Tools, Meshless Methods
  • Inverse Problems

Selected Publications

Book Chapter:

  • L. Thompson, P. Kunthong, And S. Subbarayalu, Chapter On “stabilized Time-discontinuous Galerkin Methods With Applications To Acoustics,” In Computational Methods For Acoustics Problems, Edited By F. Magoules, Saxe-coburg Publications, 2008.

Journal Papers:

  • P. Kunthong And L.l. Thompson, “an Efficient Solver For The High-order Accurate Time-discontinuous Galerkin (Tdg) Method For Second-order Hyperbolic Systems,” Finite Elements In Analysis And Design, Vol. 41, Pp. 729-762, (2005).
  • B. Han And P. Kunthong, “micro-mechanical Deformation Analysis Of Surface Laminar Circuit In Organic Flip-chip Package: An Experimental Study,” Journal Of Electronic Packaging, Transaction Of The Asme, Vol. 122, No. 3, Pp. 294-300 (2000).

Conference Papers:

  • L.l. Thompson And P. Kunthong, “stabilized Time-discontinuous Galerkin Methods With Applications To Acoustics,” Proceedings Of Imece’06, 2006 Asme International Mechanics Engineering Congress & Exposition, November 5-10, 2006, Chicago, Illinois, Usa.
  • L.l. Thompson And P. Kunthong, “a Residual Based Variational Method For Reducing Dispersion Error In Finite Element Methods,” Proceedings Of Imece’05, 2005 Asme International Mechanics Engineering Congress & Exposition, November 5-7, 2005, Orlando, Florida, Usa.
  • K. Verma, P. Kunthong, And B. Han, “effect Of Underfill On C4 Bumps And Surface Laminar Circuit: An Experimental Study By Microscopic Moiré Interferometry,” In Proc. Spie – Int. Soc. Opt. Eng., Vol. 3906, 1999, Pp. 605-610.
  • K. Verma, P. Kunthong And B. Han, “thermo-mechanical Strains Of Flip-chip Solder Bumps On Organic Pcb Substrate,” Proceedings Of The International Mechanical Engineering Congress And Exposition, Asme Winter Meeting, Anaheim, Ca, (November 1998).