ผศ.ดร. ประพจน์ ขุนทอง

ผู้ช่วยศาสตราจารย์

Contact Information

ห้องทำงาน: 5402/13
เบอร์ติดต่อ: 02-797-0999 ต่อ 1803-1804
อีเมล์: fengppk@ku.ac.th

Administrative Work

• Deputy Head, Department of Mechanical Engineering

Education

• B.eng. (Mechanical Engineering), Kasetsart University, Thailand
• M.s. (Engineering Mechanics, Specialization In Experimental Stress Analysis), Clemson University, Usa
• Ph.d. (Civil Engineering, Specialization In Computational Mechanics), Clemson University, USA

Awards & Honors

• One Of Six Finalists For The 16th Annual Robert J. Melosh Medal Competition For The Best Student Paper On Finite Element Analysis, 2004
• Best Paper Of Session, The 32nd International Symposium On Microelectronics, Imaps, 1999

Courses

• 01208111: Engineering Drawing
• 01208221: Engineering Mechanics I (Statics)
• 01208261: Mechanics Of Solids
• 01208271: Computer Methods For Mechanical Engineering
• 01208496: Selected Topics In Me: Introduction To Finite Element Methods
• 01208511: Engineering Analysis For Mechanical Engineers
• 01208533: Experimental Stress Analysis

Fields of Interest

• Experimental Stress Analysis: Photoelasticity, Moire Interferometry
• Computational Mechanics: Space-time Discontinuous Galerkin Finite Element Methods, Residual Based Finite Element Methods, Numerical Methods For Problems In Infinite Domains, Fatigue Analysis Using Numerical Tools, Meshless Methods
• Inverse Problems

Selected Publications

Book Chapter:

• L. Thompson, P. Kunthong, And S. Subbarayalu, Chapter On “stabilized Time-discontinuous Galerkin Methods With Applications To Acoustics,” In Computational Methods For Acoustics Problems, Edited By F. Magoules, Saxe-coburg Publications, 2008.

Journal Papers:

• P. Kunthong And L.l. Thompson, “an Efficient Solver For The High-order Accurate Time-discontinuous Galerkin (Tdg) Method For Second-order Hyperbolic Systems,” Finite Elements In Analysis And Design, Vol. 41, Pp. 729-762, (2005).
• B. Han And P. Kunthong, “micro-mechanical Deformation Analysis Of Surface Laminar Circuit In Organic Flip-chip Package: An Experimental Study,” Journal Of Electronic Packaging, Transaction Of The Asme, Vol. 122, No. 3, Pp. 294-300 (2000).

Conference Papers:

• L.l. Thompson And P. Kunthong, “stabilized Time-discontinuous Galerkin Methods With Applications To Acoustics,” Proceedings Of Imece’06, 2006 Asme International Mechanics Engineering Congress & Exposition, November 5-10, 2006, Chicago, Illinois, Usa.
• L.l. Thompson And P. Kunthong, “a Residual Based Variational Method For Reducing Dispersion Error In Finite Element Methods,” Proceedings Of Imece’05, 2005 Asme International Mechanics Engineering Congress & Exposition, November 5-7, 2005, Orlando, Florida, Usa.
• K. Verma, P. Kunthong, And B. Han, “effect Of Underfill On C4 Bumps And Surface Laminar Circuit: An Experimental Study By Microscopic Moiré Interferometry,” In Proc. Spie – Int. Soc. Opt. Eng., Vol. 3906, 1999, Pp. 605-610.
• K. Verma, P. Kunthong And B. Han, “thermo-mechanical Strains Of Flip-chip Solder Bumps On Organic Pcb Substrate,” Proceedings Of The International Mechanical Engineering Congress And Exposition, Asme Winter Meeting, Anaheim, Ca, (November 1998).